Camera module having image sensor located between first and second circuit boards

ABSTRACT

A camera module includes a lens driving device having a housing, a first circuit board disposed below the housing, a filter disposed on an upper surface of the first circuit board, a second circuit board disposed below the first circuit board, an image sensor disposed on the second circuit board and coupled to a lower surface of the first circuit board, and a first adhesive member disposed between the lower surface of the first circuit board and an upper surface of the second circuit board, and electrically connecting the first circuit board and the second circuit board. A lower surface of the image sensor is higher than the upper surface of the second circuit board.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. application Ser. No.17/081,424, filed Oct. 27, 2020, which is a continuation of U.S.application Ser. No. 16/097,184, filed Oct. 26, 2018, now U.S. Pat. No.10,848,657, issued Nov. 24, 2020, which is the National Phase of PCTInternational Application No. PCT/KR2017/004573, filed on Apr. 28, 2017,which claims priority under 35 U.S.C. 119(a) to Patent Application No.10-2016-0052784, filed in the Republic of Korea on Apr. 29, 2016, PatentApplication No. 10-2016-0060304, filed in the Republic of Korea on May17, 2016 and Patent Application No. 10-2017-0009288, filed in theRepublic of Korea on Jan. 19, 2017, all of which are hereby expresslyincorporated by reference into the present application.

TECHNICAL FIELD

Embodiments relate to a camera module and a portable device includingthe same.

This disclosure relates to an image sensor package and a camera deviceincluding the same. More particularly, this disclosure relates to animage sensor package capable of simplifying a process and minimizing athickness thereof, and a camera device including the same.

BACKGROUND ART

The content described in this part merely provides backgroundinformation related to embodiments and does not constitute the relatedart.

A mobile phone or a smart phone, equipped with a camera module whichfunctions to photograph a subject and to store a still image or a movingimage of the subject, has been developed. Generally, the camera modulemay include a lens, an image sensor module, and a lens moving device,which adjusts the distance between the lens and the image sensor module.

The lens moving device may perform auto-focusing to adjust the focallength of the lens by adjusting the distance between an image sensor andthe lens.

In addition, the camera module may shake minutely due to, for example,shaking of the user's hand while photographing a subject. In order tocorrect distortion of a still image or a moving image due to the shakingof the user's hand, a lens moving device, to which an optical imagestabilizer (OIS) function is added, has been developed.

Meanwhile, with the miniaturization of the camera module, it has becomepossible to install the camera module in various electronic devices aswell as mobile devices. Recently, as a mobile device capable ofimproving a communication environment thereof and performing videocommunication becomes popular, the development of a front camera modulehaving a high-resolution image sensor capable of supportinghigh-definition video communication has been demanded.

Typically, the front camera module is located in the bezel portion of amobile device. However, the front camera module having a high-resolutionimage sensor is larger than a conventional front camera module having alow-resolution image sensor. Thus, when the front camera module having ahigh-resolution image sensor is installed in order to realizehigh-definition video communication, the size of a bezel in the mobiledevice increases and it is difficult to miniaturize the device and toreduce the size of the bezel.

Technical Object

Embodiments relate to a camera module having a slim overall structureand a portable device including the same.

The technical objects acquired by the embodiments are not limited to thetechnical objects mentioned above, and other unmentioned technicalobjects will be clearly understood by those skilled in the art, to whichthe embodiments belong, from the following description.

Embodiments provide a camera module capable of reducing the size thereofand preventing optical tilt.

This disclosure provides an image sensor package capable of simplifyinga manufacturing process and reducing the overall thickness thereof and acamera device including the same.

The technical objects acquired by this disclosure are not limited to thetechnical objects mentioned above, and other unmentioned technicalobjects will be clearly understood by those skilled in the art, to whichthis disclosure belongs, from the following description.

Technical Solution

According to one embodiment, a camera module includes: a lens movingdevice including a base provided at an underside thereof; a first holdercoupled to the base and provided with a filter; an image sensor coupledto an underside of the first holder; and

a second holder coupled to the first holder and configured to surroundthe image sensor, wherein the first holder and the second holder arecoupled and electrically connected to each other by a conductiveadhesive.

The lens moving device may include a bobbin provided so as to move in afirst direction; a first coil provided on an outer circumferentialsurface of the bobbin; a housing inside which the bobbin is provided; afirst magnet coupled to the housing; an upper elastic member provided atan upper side of the bobbin to support the bobbin; a lower elasticmember provided at a lower side of the bobbin to support the bobbin; thebase disposed below the bobbin; and a printed circuit board seated onthe base.

The conductive adhesive may be provided as an anisotropic conductivefilm (ACF).

The first holder and the image sensor may be coupled and electricallyconnected to each other through a flip chip process.

The first holder and the image sensor may be coupled and electricallyconnected to each other by a conductive adhesive.

According to the embodiment, the camera module may further include areinforcement member coupled to a lower surface of the second holder.

The image sensor may be formed with a printed terminal unit, which isadhered to the conductive adhesive and is coupled and electricallyconnected to the first holder.

The second holder may include a connection board for electricalconnection with an external device.

The filter may be an infrared-blocking filter or a blue filter.

The second holder may be formed with a hollow region and the imagesensor may be accommodated in the hollow region.

According to the embodiment, the camera module may further include areinforcement member disposed below the second holder.

The lens moving device may further include: a support member disposed ona side surface of the housing to support movement of the housing in asecond direction and/or a third direction; and a second coil disposed soas to be opposite the first magnet.

According to another embodiment, a camera module includes: a lens barrelprovided with at least one lens; a bobbin configured to accommodate thelens barrel therein; a cover member configured to accommodate the bobbintherein; a first holder disposed below the bobbin and provided with afilter; an image sensor coupled to an underside of the first holder andprovided with a sensing unit, which is disposed so as to be opposite thefilter in a first direction; and a second holder coupled to the first holder and configured to surround the image sensor, wherein the firstholder and the second holder are coupled and electrically connected toeach other by a conductive adhesive, and wherein the image sensor isaccommodated in a hollow region formed in the second holder, and areinforcement member is provided on a lower surface of the second holderso as to close the hollow region.

According to still another embodiment, a camera module includes: a lensmoving device including a base at an underside thereof; a first holdercoupled to the base and provided with a filter; an image sensor coupledto an underside of the first holder and provided with a sensing unit,which is disposed so as to be opposite the filter in a first direction;and a second holder coupled to the first holder and configured tosurround the image sensor, wherein the first holder and the secondholder are coupled and electrically connected to each other by aconductive adhesive, and wherein the image sensor is accommodated in ahollow region formed in the second holder, and a reinforcement member isprovided on a lower surface of the second holder so as to close thehollow region.

According to an embodiment, a portable device includes a display moduleincluding a plurality of pixels, a color of which is varied by anelectric signal; the camera module configured to convert an imageintroduced through a lens into an electric signal; and a controllerconfigured to control an operation of the display module and the cameramodule.

A camera module according to an embodiment includes: a first printedcircuit board; first adhesive members disposed on the first printedcircuit board so as to be spaced apart from each other; a second printedcircuit board adhered at a lower edge thereof to the first adhesivemember; an image sensor coupled to a lower portion of the second printedcircuit board and disposed between the first adhesive members; a filterdisposed on the second printed circuit board; and a housing disposed onan upper edge of the second printed circuit board.

For example, the centerline of the lower cross section of the housingmay be disposed in an area in which it coincides with the centerline ofthe first adhesive member in a vertical direction.

For example, the first adhesive member may be a solder ball.

For example, a second adhesive member may be disposed between the uppersurface of the second printed circuit board and the lower cross sectionof the housing.

For example, the second adhesive member may include at least one ofthermosetting epoxy or UV curing epoxy.

For example, the second printed circuit board may be formed with agroove, into which the lower end of the housing is inserted.

For example, a protrusion may be formed on the upper outer side of thesecond printed circuit board so as to abut the outer lower end of thehousing.

For example, the image sensor may be flip-chip bonded to the secondprinted circuit board.

For example, an infrared-blocking layer may be disposed on the surfaceof the filter.

For example, the camera module may further include a lens holder coupledinside the housing and having at least one lens disposed therein.

For example, the camera module may further include a passive elementdisposed on the edge of the first printed circuit board.

An image sensor package according to an embodiment of the disclosureincludes: an image sensor configured to generate image data; a rigidflexible printed circuit board (RFPCB) directly connected to the imagesensor and disposed on the image sensor; a filter configured to block aspecific wavelength band of light and disposed on the RFPCB; and areinforcement member disposed between the RFPCB and the filter.

In some embodiments, the RFPCB may further include a connectorelectrically connected to the RFPCB and serving to transmit the imagedata to an external host controller, the RFPCB may include an FPCB,which is exposed to the outside between an area connected to the imagesensor and an area connected to the connector, and the reinforcementmember may be bonded to the RFPCB in the area excluding the FPCB exposedto the outside.

In some embodiments, the reinforcement member may be formed of aluminum.

In some embodiments, the thickness of the RFPCB may range from 0.15 mmto 0.25 mm, and the thickness of the reinforcement member may range from0.05 mm to 0.15 mm.

In some embodiments, the image sensor and the RFPCB may be electricallyconnected through a flip chip process.

In some embodiments, an area of the RFPCB, which corresponds to anactive area of the image sensor, may be removed.

In some embodiments, the image sensor package may further include aprotective cap attached to the RFPCB so as to surround the image sensor.

A camera device according to an embodiment of the disclosure includes:the image sensor package; and a host controller configured to generate acontrol signal for controlling the image sensor.

The aspects of this disclosure are merely some of exemplary embodimentsdisclosed here, and various embodiments, in which the technical featuresof this disclosure are reflected, will be derived and understood basedon the detailed description of this disclosure, which will be set forthbelow, by those skilled in the art.

Advantageous Effects

In the embodiment, unlike an SMT process, when the respective holdersare coupled and electrically connected to each other using the ACF,since no separate wire or solder is used, it is possible to reduce thespace occupied by wiring and solder, and thus, to reduce the overalllength of the camera module in the first direction.

In addition, when using the ACF, since heating only to the meltingtemperature of an adhesive resin, which is much lower than the meltingtemperature of a solder, is sufficient, excessive heat is not applied toindividual holders, and thus, it is possible to significantly reduce theoccurrence of thermal damage to the individual holders.

In addition, due to the structure in which the image sensor isaccommodated in the hollow region, a separate space in which the imagesensor is disposed is unnecessary in the camera module, and thus, it ispossible to reduce the overall length of the camera module. Accordingly,the camera module may have a slim structure as a whole.

The camera module according to the embodiment may be reduced in size andmay realize a high-resolution image.

Effects of the device according to the disclosure will be described asfollows.

With the image sensor package and the camera device including the sameaccording to the embodiment of the present invention, it is possible toreduce the sum of thicknesses of the image sensor package and the lensassembly, and consequently, to increase the margin of design in thevertical direction of the lens assembly.

In addition, it is possible to increase the margin of design for othermodules, which may be disposed under the image sensor, and at the sametime, to reduce the overall thickness of the camera device, which maycontribute to miniaturization.

In addition, the process required for electrical connection from theimage sensor to the PCB substrate requires only one flip chip process,which can simplify the entire process.

The effects acquired by this disclosure are not limited to the effectsmentioned above, and other unmentioned effects will be clearlyunderstood by those skilled in the art, to which this disclosurebelongs, from the following description.

DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view illustrating a camera module according toan embodiment.

FIG. 2 is an exploded perspective view illustrating a lens moving deviceaccording to the embodiment.

FIG. 3 is a perspective view illustrating a base, a first holder, and asecond holder according to the embodiment.

FIG. 4 is a schematic side cross-sectional view of a camera moduleaccording to the embodiment.

FIG. 5 is a schematic plan view of an image sensor according to theembodiment.

FIG. 6 is a schematic plan view of a second holder, a connection board,and a reinforcement member according to the embodiment.

FIG. 7 is a perspective view illustrating a portable device according toan embodiment.

FIG. 8 is a view illustrating the configuration of the portable deviceillustrated in FIG. 7 .

FIGS. 9 a and 9 b are cross-sectional views illustrating a camera moduleaccording to a first embodiment.

FIG. 10 is a cross-sectional view illustrating a camera module accordingto a second embodiment.

FIG. 11 is a cross-sectional view illustrating a camera module accordingto a third embodiment.

FIG. 12 is an explanatory view of an example of a camera deviceaccording to an embodiment of this disclosure.

FIG. 13 is a view illustrating one embodiment of an image sensor packageillustrated in FIG. 12 .

FIG. 14 is a view illustrating another embodiment of the image sensorpackage illustrated in FIG. 12 .

FIG. 15 is a top view of the image sensor package illustrated in FIG. 13or FIG. 14 .

FIG. 16 is a view illustrating an image sensor package according to acomparative example of this disclosure.

BEST MODE

A camera module according to an embodiment of the present inventionincludes: a lens moving device including a base; a printed circuit board(PCB) including an upper surface, an outer side of which is coupled tothe base and an inner side of which is coupled to a filter; an imagesensor coupled to an inner side of a lower surface of the PCB; and aflexible printed circuit board (FPCB) coupled to an outer side of thelower surface of the PCB and configured to surround the image sensor,wherein the PCB and FPCB may be coupled and electrically connected toeach other by a conductive adhesive.

MODE FOR INVENTION

Hereinafter, the embodiments will be described in detail with referenceto the accompanying drawings. The embodiments may be modified in variousways and may take various other forms, and specific embodiments will beillustrated in the drawings and described in detail herein. However,this has no intention to limit the embodiments to the specific formsdisclosed herein, and it should be understood that all modifications,equivalents, and substitutions may be devised within the spirit andscope of the embodiments.

Although terms such as, for example, “first” and “second” may be used todescribe various elements, the elements should not be limited by theterms. These terms are merely used to distinguish the same or similarelements from each other. In addition, the terms particularly definedtaking into consideration the configurations and functions of theembodiments are merely given to describe the embodiments and should notbe intended to limit the scope of the embodiments.

In the description of the embodiments, it will be understood that, whenan element is referred to as being formed “on” or “under” anotherelement, it can be directly “on” or “under” the other element or beindirectly formed with intervening elements therebetween. It will alsobe understood that “on” or “under” the element may be described relativeto the drawings.

In addition, relative terms such as, for example, “on/upper/above” and“beneath/lower/below”, used in the following description may be used todistinguish any one substance or element with another substance orelement without requiring or containing any physical or logicalrelationship or sequence between these substances or elements.

In addition, in the drawings, the orthogonal coordinate system (x, y, z)may be used. In the drawings, the x-axis and the y-axis define a planeorthogonal to the optical axis. For convenience, the optical-axisdirection (the z-axis direction) may be referred to as a “firstdirection”, the x-axis direction may be referred to as a “seconddirection”, and the y-axis direction may be referred to as a “thirddirection”.

FIG. 1 is a perspective view illustrating a camera module according toan embodiment, and FIG. 2 is an exploded perspective view illustrating alens moving device 100 according to the embodiment.

An optical image stabilizer, which is applied to a small-sized cameramodule of a portable device, such as a smart phone or a tablet PC,refers to a device that is configured so as to prevent the outline of aphotographed image from being indistinctly formed due to vibrationscaused by shaking of the user's hand while photographing a still image.

In addition, an auto-focusing device is a device that automaticallyfocuses the image of a subject on an image sensor 500. The optical imagestabilizer and the auto-focusing device may be configured in variousways. In the embodiment, an optical module including a plurality oflenses may be moved in a first direction, or may be moved in a directionperpendicular to the first direction, so as to perform an optical imagestabilization operation and/or an auto-focusing operation.

As illustrated in FIG. 1 , the camera module according to the embodimentmay include the lens moving device 100, a first holder 400, and a secondholder 600.

The lens moving device 100 may include a base 210, which is disposedthereunder and is adhered to the first holder 400. As described above,the lens moving device 100 may perform an optical image stabilizationoperation and/or an auto-focusing operation by moving the optical modulecomposed of the plurality of lenses. The specific structure of the lensmoving device 100 will be described below with reference to FIG. 2 .

The first holder 400 may be coupled to the base 210, and a filter 410may be mounted on the first holder. In addition, the image sensor 500may be coupled to the underside of the first holder 400. The imagesensor 500 will be described below in detail with reference to FIG. 4 ,for example. The second holder 600 may be disposed below the firstholder 400. Meanwhile, the first holder, the image sensor, and thesecond holder may be provided as circuit boards.

The second holder 600 may include various driving drivers for drivingthe lens moving device 100 and circuits for receiving current, receivingelectric signals from external devices, or transmitting electric signalsto the external devices. Of course, in the case of a camera module whichdoes not have an auto-focusing function or an optical imagestabilization function and does not require a separate lens movingdevice, the second holder 600 may not include a driver.

In addition, the second holder 600 may be provided with a connectionboard 610 for electrical connection between the second holder 600 and anexternal device such as, for example, a power supply, a display device,or a storage device.

The first holder 400 and the second holder 600 will be described belowin detail with reference to FIG. 3 and the following drawings.

As illustrated in FIG. 2 , the lens moving device 100 according to theembodiment may include a movable unit and a fixed unit. Here, themovable unit may perform the auto focusing function of a lens. Themovable unit may include a bobbin 110 and a first coil 120. The fixedunit may include a first magnet 130, a housing 140, an upper elasticmember 150, and a lower elastic member 160.

The bobbin 110 may be provided so as to move in the first directioninside the housing 140, may be provided on the outer circumferentialsurface thereof with the first coil 120, which is disposed inside thefirst magnet 130, and may be provided in the inner space of the housing140 so as to be reciprocally movable in the first direction byelectromagnetic interaction between the first magnet 130 and the firstcoil 120. The first coil 120 may be provided on the outercircumferential surface of the bobbin 110 so as to enableelectromagnetic interaction with the first magnet 130.

In addition, the bobbin 110 may be elastically supported by the upperand lower elastic members 150 and 160, and may perform an auto-focusingfunction by moving in the first direction.

The bobbin 110 may include a lens barrel (not illustrated) in which atleast one lens is provided. The lens barrel may be coupled inside thebobbin 110 in various ways.

For example, the lens barrel may be coupled to the bobbin 110 using anadhesive or the like. In addition, the lens barrel may be coupled to thebobbin 110 through screwing. Alternatively, one or more lenses may beintegrally formed with the bobbin 110 without a lens barrel.

Only one lens may be coupled to the lens barrel, or two or more lensesmay be configured so as to form an optical system.

The auto-focusing function may be controlled according to the directionof current, and the auto-focusing function may be realized by moving thebobbin 110 in the first direction. For example, when forward current isapplied, the bobbin 110 may move upwards from the initial positionthereof, and when reverse current is applied, the bobbin 110 may movedownwards from the initial position thereof. Alternatively, the amountof unidirectional current may be adjusted to increase or decrease thedistance of movement from the initial position in a given direction.

The upper and lower surfaces of the bobbin 110 may be formed with aplurality of upper support protrusions and lower support protrusions.The upper support protrusions may be provided in a cylindrical shape orin a prismatic shape, and may serve to couple and fix the upper elasticmember 150. The lower support protrusions may be provided in acylindrical shape or in a prismatic shape, and may serve to couple andfix the lower elastic member 160.

Here, the upper elastic member 150 may be formed with through-holescorresponding to the upper support protrusions, and the lower elasticmember 160 may be formed with through-holes corresponding to the lowersupport protrusions. The respective support protrusions and thethrough-holes may be fixedly coupled to each other using an adhesivemember, such as epoxy, or by thermal bonding.

The housing 140 may take the form of a hollow column to support thefirst magnet 130, and may have a substantially rectangular shape. Thefirst magnet 130 may be coupled to and disposed on the side surfaceportion of the housing 140. In addition, as described above, the bobbin110, which is guided by the upper and lower elastic members 150 and 160so as to move in the first direction, may be disposed inside the housing140.

The upper elastic member 150 may be provided at the upper side of thebobbin 110 and the lower elastic member 160 may be provided at the lowerside of the bobbin 110. The upper elastic member 150 and the lowerelastic member 160 may be coupled to the housing 140 and the bobbin 110,and the upper elastic member 150 and the lower elastic member 160 mayelastically support the upward movement and/or the downward movement ofthe bobbin 110 in the first direction. The upper elastic member 150 andthe lower elastic member 160 may be provided as leaf springs.

As illustrated in FIG. 2 , the upper elastic member 150 may be providedas a plurality of parts separated from each other. Through such amulti-split structure, the respective split parts of the upper elasticmember 150 may receive current having different polarities or differentvoltages. In addition, the lower elastic member 160 may have amulti-split structure and may be electrically connected to the upperelastic member 150.

Meanwhile, the upper elastic member 150, the lower elastic member 160,the bobbin 110, and the housing 140 may be assembled through thermalbonding and/or bonding using an adhesive or the like.

The base 210 may be disposed below the bobbin 110 and may be provided ina substantially rectangular shape, and a printed circuit board 250 maybe disposed or seated on the base.

A surface of the base 210, which faces a portion of the printed circuitboard 250 in which a terminal surface 253 is formed, may be formed witha support groove having a size corresponding to the terminal surface.The support groove may be recessed inward to a predetermined depth fromthe outer circumferential surface of the base 210 so as to prevent theportion, on which the terminal surface 253 is formed, from protrudingoutwards or to adjust the extent to which the portion protrudes.

A support member 220 may be disposed on the side surface of the housing140 so as to be spaced apart from the housing 140. The support membermay be coupled at the upper end thereof to the upper elastic member 150and at the lower end thereof to the base 210, the printed circuit board250, or a circuit member 231. The support member may support the bobbin110 and the housing 140 so as to be movable in the second directionand/or the third direction perpendicular to the first direction, and mayalso be electrically connected to the first coil 120.

According to the embodiment, a total of four support members 220 may besymmetrically provided since they are respectively disposed on the outersurfaces of the respective corners of the housing 140. In addition, thesupport member 220 may be electrically connected to the upper elasticmember 150. That is, for example, the support member 220 may beelectrically connected to a portion of the upper elastic member 150 inwhich a through-hole is formed.

In addition, since the support member 220 is formed separately from theupper elastic member 150, the support member 220 and the upper elasticmember 150 may be electrically connected to each other using aconductive adhesive material, a solder, or the like. Accordingly, theupper elastic member 150 may apply electric current to the first coil120 through the support member 220, which is electrically connectedthereto.

The support member 220 may be connected to the printed circuit board 250through through-holes formed in the circuit member 231 and the printedcircuit board 250. Alternatively, the support member 220 may beelectrically soldered to a corresponding portion of the circuit member231 without forming through-holes in the circuit member 231 and/or theprinted circuit board 250.

Meanwhile, in FIG. 2 , the linear support member 220 is illustrated asone embodiment, but the disclosure is not limited thereto. That is, thesupport member 220 may be provided as a plate-shaped member or the like.

A second coil 230 may perform optical image stabilization by moving thehousing 140 in the second direction and/or in the third directionthrough electromagnetic interaction with the first magnet 130.

Here, the second and third directions may include directionssubstantially close to the x-axis direction (or the first direction) andthe y-axis direction (or the second direction) as well as the x-axis andy-axis directions. In other words, the housing 140 may move indirections parallel to the x-axis and the y-axis when viewed in terms ofdriving in the embodiment, but may also move in directions slightlyoblique to the x-axis and the y-axis when moving while being supportedby the support member 220.

Therefore, the first magnet 130 may need to be provided at a positioncorresponding to the second coil 230.

The second coil 230 may be disposed so as to be opposite the firstmagnet 130 fixed to the housing 140. In an embodiment, the second coil230 may be disposed outside the first magnet 130. Alternatively, thesecond coil 230 may be spaced apart downwards from the first magnet 130by a predetermined distance.

According to the embodiment, a total of four second coils 230 may beprovided on four side portions of the circuit member 231, but thedisclosure is not limited thereto. Only two second coils including, forexample, one second coil on a second side in the second direction andone second coil on a third side in the third direction may be provided,or more than four second coils may be provided.

Alternatively, a total of six second coils may be provided such that onesecond coil is provided on a first side in the second direction, twosecond coils are provided on the second side in the second direction,one second coil is provided on the third side in the third direction,and two second coils are provided on a fourth side in the thirddirection. Alternatively, in this case, the first side and the fourthside may be next to each other, and the second side and the third sidemay be next to each other.

In the embodiment, a circuit pattern may be formed on the circuit member231 to have the shape of the second coil 230, or a separate second coilmay be disposed on the top of the circuit member 231, but the disclosureis not limited thereto. A circuit pattern may be formed directly on thetop of the circuit member 231 to have the shape of the second coil 230.

Alternatively, the second coil 230 may be configured by winding a wirein a doughnut shape, or the second coil 230 may be formed to have an FPcoil shape and be electrically connected to the printed circuit board250.

The circuit member 231 including the second coil 230 may be provided ordisposed on the upper surface of the printed circuit board 250, which isdisposed at the upper side of the base 210. However, the disclosure isnot limited thereto. The second coil 230 may be disposed in closecontact with the base 210, may be spaced apart from the base 210 by apredetermined distance, or may be formed on a separate board so that theboard is stacked on and connected to the printed circuit board 250.

The printed circuit board 250 may be electrically connected to at leastone of the upper elastic member 150 or the lower elastic member 160 andmay be coupled to the upper surface of the base 210. As illustrated inFIG. 2 , the printed circuit board may be formed with a through-hole,into which the support member 220 is inserted, at a position thatcorresponds to an end of the support member 220. Alternatively, theprinted circuit board may be electrically connected and/or bonded to thesupport member without forming a through-hole.

A terminal 251 may be disposed or formed on the printed circuit board250. In addition, the terminal 251 may be disposed on the bent terminalsurface 253. A plurality of terminals 251 may be disposed on theterminal surface 253, and may supply current to the first coil 120and/or the second coil 230 when receiving an external voltage. Thenumber of terminals formed on the terminal surface 253 may be increasedor decreased based on the type of constituent elements that need to becontrolled. In addition, the printed circuit board 250 may include oneterminal surface 253 or two or more terminal surfaces.

A cover member 300 may be provided in a substantially box shape, mayaccommodate, for example, the movable unit, the second coil 230, and aportion of the printed circuit board 250 therein, and may be coupled tothe base 210. The cover member 300 may protect, for example, the movableunit, the second coil 230, and the printed circuit board 250, which areaccommodated therein, so as to prevent damage thereto. In addition, thecover member may limit outward leakage of an electromagnetic field,which is created by, for example, the first magnet 130, the first coil120, and the second coil 230 therein, thereby enabling theelectromagnetic field to be focused.

The embodiment of the camera module having the auto-focusing functionand the optical image stabilization function has been described above.

On the other hand, according to another embodiment, the camera modulemay include a lens moving device, which has an auto-focusing functionbut does not have an optical image stabilization function. In this case,for example, the lens moving device may be obtained by removing thesupport member 220, the second coil 230, and the circuit memberincluding the second coil 230 from the lens moving device illustrated inFIG. 2 .

According to still another embodiment of the present invention, thecamera module may be provided in a structure having no auto-focusing andoptical image stabilization functions. In this case, for example, thecamera module may include the lens barrel, the bobbin 110, whichaccommodates the lens barrel therein, and the cover member 300, whichaccommodates the bobbin therein.

FIG. 3 is a perspective view illustrating the base 210, the first holder400, and the second holder 600 according to an embodiment.

The filter 410 may be mounted in the first holder 400. The filter 410may be mounted in the first holder 400 at a position at which it facesthe lens barrel and the image sensor 500 in the first direction. Thefilter 410 may filter light within a specific wavelength range ofincident light directed through the lens barrel, and the light, whichhas passed through the filter 410, may be incident on a sensing unit 510provided in the image sensor 500.

The first holder 400 may be a printed circuit board (PCB) fortransmitting a voltage, a control signal, an image signal, or the like,but the scope of the disclosure is not limited thereto. Here, the filter410 may be, for example, an infrared filter that prevents infrared lightfrom being incident on the image sensor 500. In another embodiment, thefilter 410 may be a blue filter. The blue filter may be formed on thesurface thereof with a coating layer for blocking ultraviolet light, andmay advantageously effectively prevent ghost and flare phenomena, whichoccur in an image formed on the sensing unit 510, unlike a generalinfrared filter.

The second holder 600 may be formed of a flexible material or a hardmaterial. However, in order to allow the connection board 610, which iselectrically connected to the second holder 600, to be easily connectedto external devices and the camera module, the second holder may beformed of a flexible material that is easily changed in position.

The second holder 600 may be a flexible printed circuit board (FPCB),which transmits a voltage, a control signal, an image signal or the likeand is easily deformed according to design specifications, but the scopeof the disclosure is not limited thereto.

FIG. 4 is a schematic side cross-sectional view of a camera moduleaccording to the embodiment. FIG. 5 is a schematic plan view of theimage sensor 500 according to the embodiment. FIG. 6 is a schematic planview of the second holder 600, the connection board 610, and areinforcement member 650 according to the embodiment.

As illustrated in FIG. 4 , the camera module may further include theimage sensor 500. The image sensor 500 may be coupled to the undersideof the first holder 400, and the sensing unit 510 may be mounted on theimage sensor. Here, the sensing unit 510 of the image sensor 500 may bedisposed in the first direction so as to be opposite the filter 410. Thesensing unit 510 is a region on which light, which has passed throughthe filter 410, is incident to form an image.

As illustrated in FIG. 4 , the filter 410 may be coupled to the innerside of the upper surface of the first holder 400, and the base 210 maybe coupled to the outer side of the upper surface of the first holder.The image sensor 500 may be coupled to the inner side of the lowersurface of the first holder 400, and the second holder 600 may becoupled to the outer side of the lower surface of the first holder 400.Here, the inner side and the outer side may be defined on the basis ofthe center of the incident surface of the light, which has passedthrough the filter 410. The filter 410 may be attached and coupled tothe upper surface of the first holder 400 by an adhesive such as epoxy,for example.

The light, which has passed through the filter 410, may be incident onthe sensing unit 510. Thus, as illustrated in FIG. 4 , a through-holemay be formed in the first holder 400 so that light may passtherethrough in a region in which the filter 410 and the sensing unit510 are opposite each other.

Meanwhile, the first holder 400 and the image sensor 500 may be coupledand electrically connected to each other. As illustrated in FIG. 4 , thefirst holder 400 and the image sensor 500 may be coupled andelectrically connected to each other by a second coupling portion T2.

The coupling and electrical connection between the first holder 400 andthe image sensor 500 may be realized through, for example, a flip chipprocess. That is, the second coupling portion T2 may be formed through aflip chip process.

The flip chip process may be performed by, for example, spraying aconductive material onto the first holder 400 and/or the image sensor500 to attach the first holder 400 and the image sensor 500 to eachother. The first holder 400 and the image sensor 500 may be coupled andelectrically connected to each other via fusion of the conductivematerial.

The flip chip process has a simpler structure, and more particularly, athinner coupling region than a surface mount technology (SMT) process,which is commonly used for the coupling and electrical connection of aboard. Therefore, the flip chip process may reduce the overall length ofthe camera module in the first direction.

Meanwhile, in another embodiment, the coupling and electrical connectionbetween the first holder 400 and the image sensor 500 may be realizedusing a conductive adhesive. That is, in FIG. 4 , the second couplingportion T2, which couples and electrically interconnects the firstholder 400 and the second holder 600, may be formed of a conductiveadhesive.

The conductive adhesive may be, for example, an anisotropic conductivefilm (ACF). Such a conductive adhesive will be described in detail withrelation to the coupling structure of the first holder 400 and thesecond holder 600.

The first holder 400 and the second holder 600 may be coupled andelectrically connected to each other using a conductive adhesive. Thatis, in FIG. 4 , a first coupling portion T1, which couples andelectrically interconnects the first holder 400 and the second holder600, may be formed of a conductive adhesive.

The conductive adhesive may be, for example, an anisotropic conductivefilm (ACF). The ACF is entirely in the form of a film, and may be madeby mixing conductive particles, for example, gold (Au) or nickel (Ni)particles with an adhesive resin.

The first holder 400 and the second holder 600 are coupled to each otherby disposing the ACF on a coupling portion of the first holder 400 andthe second holder 600 and pressing and heating the ACF, and may beelectrically connected to each other by the conductive particles.

When the first holder 400 and the second holder 600 are coupled andelectrically connected to each other by the SMT process, a wire and asolder may be used. Therefore, in the case of the SMT process, the spaceoccupied by the wire and the solder is required, so that the overalllength of the camera module in the first direction may be increased.

In addition, in the SMT process, the process of melting and curing thesolder may be repeated, and to this end, excessive heat may be appliedto the respective holders. Therefore, thermal damage to the holders,which are provided in a board shape, may occur.

However, since the ACF does not use separate wire or solder, the spaceoccupied by the wire and the solder may be eliminated, and thus theoverall length of the camera module in the first direction may bereduced.

In addition, in the case of using the ACF, since heating only to themelting temperature of the adhesive resin, which is much lower than themelting temperature of the solder, is sufficient, excessive heat is notapplied to individual holders, and thus, it is possible to significantlyreduce the occurrence of thermal damage to the individual holders.

In an embodiment, the camera module may further include thereinforcement member 650. The reinforcement member 650 may be disposedbelow the second holder 600 and may be coupled to the lower surface ofthe second holder 600, for example. As illustrated in FIG. 6 , thereinforcement member 650 may be provided in a plate shape, for example,and may be formed of a material including stainless steel, for example.

The second holder 600 may be formed with a hollow region VC foraccommodating therein the image sensor 500, and foreign substances maybe introduced into the camera module due to the hollow region VC.

Therefore, the reinforcement member 650 may function to close the hollowregion VC so as to prevent foreign substances from being introduced intothe camera module. The reinforcement member 650 may be adhered to thelower surface of the second holder 600 using an adhesive such as, forexample, epoxy in order to effectively seal the hollow region VC.

As illustrated in FIG. 5 , the image sensor 500 may include a printedterminal unit 550. The conductive adhesive may be adhered to the printedterminal unit 550 so that the printed terminal unit 550 may be coupledand electrically connected to the first holder 400.

That is, the second coupling portion T2 may be coupled to the printedterminal unit 550. Here, the sensing unit 510 may be electricallyconnected to the first holder 400 via the printed terminal unit 550.

Meanwhile, the second holder 600 may be coupled to the first holder 400and may surround the image sensor 500. As illustrated in FIG. 4 , thesecond holder 600 may be formed with the hollow region VC, and the imagesensor 500 may be accommodated in the hollow region VC.

Since the image sensor 500 is accommodated in the hollow region VC, thecamera module does not require a separate space in which the imagesensor 500 is disposed, and thus, the overall length of the cameramodule in the first direction may be reduced. Accordingly, the cameramodule may have a slim overall structure.

FIG. 7 is a perspective view illustrating a portable device according toan embodiment. FIG. 8 is a view illustrating the configuration of theportable device illustrated in FIG. 7 .

Referring to FIGS. 7 and 8 , the portable device 200A (hereinafterreferred to as a “device”) may include a body 850, a wirelesscommunication unit 710, an A/V input unit 720, a sensing unit 740, aninput/output unit 750, a memory 760, an interface unit 770, a controller780, and a power supply unit 790.

The body 850 illustrated in FIG. 7 has a bar shape, but is not limitedthereto. The body may have any of various structures such as a slidetype, a folder type, a swing type, or a swivel type, in which two ormore sub-bodies are coupled so as to be movable relative to each other.

The body 850 may include a case (e.g., a casing, a housing, or a cover)forming the external appearance thereof. For example, the body 850 maybe divided into a front case 851 and a rear case 852. Various electroniccomponents of the device may be mounted in the space formed between thefront case 851 and the rear case 852.

The wireless communication unit 710 may include one or more modules,which enable wireless communication between the device 200A and awireless communication system or between the device 200A and the networkin which the device 200A is located. For example, the wirelesscommunication unit 710 may include a broadcast receiving module 711, amobile communication module 712, a wireless Internet module 713, a nearfield communication module 714, and a location information module 715.

The audio/video (A/V) input unit 720 serves to input an audio signal ora video signal, and may include a camera 721 and a microphone 722.

The camera 721 may be the camera including the lens moving device 100according to the embodiment illustrated in FIG. 2 .

The sensing unit 740 may sense the current state of the device 200A,such as the opening/closing state of the device 200A, the position ofthe device 200A, the presence or absence of a user touch, theorientation of the device 200A, and the acceleration/deceleration of thedevice 200A, and may generate a sensing signal for controlling theoperation of the device 200A. For example, when the device 200A is inthe form of a slide phone, the sensing unit may sense whether the slidephone is opened or closed. In addition, the sensing unit functions tosense whether or not the power supply unit 790 supplies a voltage, orwhether or not the interface unit 770 is connected to an externaldevice.

The input/output unit 750 serves to generate input or output related toa visual sense, auditory sense, tactile sense, or the like. Theinput/output unit 750 may generate input data for controlling theoperation of the device 200A, and may also display information processedin the device 200A.

The input/output unit 750 may include a keypad unit 730, a displaymodule 751, a sound output module 752, and a touchscreen panel 753. Thekeypad unit 730 may generate input data in response to input made on akeypad.

The display module 751 may include a plurality of pixels, the color ofwhich is varied in response to an electric signal. For example, thedisplay module 751 may include at least one selected from among a liquidcrystal display, a thin film transistor-liquid crystal display, anorganic light-emitting diode, a flexible display, and athree-dimensional display (3D display).

The sound output module 752 may output audio data received from thewireless communication unit 710 in a call signal reception mode, a callmode, a recording mode, a voice recognition mode, a broadcast receptionmode, or the like, or may output audio data stored in the memory 760.

The touchscreen panel 753 may convert a change in capacitance caused bya user's touch on a specific area of a touchscreen into an electricinput signal.

The memory 760 may store a program for processing and controlling thecontroller 780, and may temporarily store input/output data (e.g., atelephone directory, messages, audio, still images, photographs, andmoving images). For example, the memory 760 may store an imagephotographed by the camera 721, for example, a photograph or a movingimage.

The interface unit 770 serves as a connection path for an externaldevice connected to the device 200A. The interface unit 770 receivesdata from the external device, or receives a voltage and transmits thevoltage to each component in the device 200A, or allows data in thedevice 200A to be transmitted to the external device. For example, theinterface unit 770 may include a wired/wireless headset port, anexternal charger port, a wired/wireless data port, a memory card port, aport for connecting a device equipped with an identification module, anaudio input/output (I/O) port, a video input/output (I/P) port, anearphone port, and the like.

The controller 780 may control the overall operation of the device 200A.For example, the controller 780 may perform related control andprocessing for voice call, data communication, video call, and the like.The controller 780 may include a panel controller 144 of the touchscreenpanel drive unit illustrated in FIG. 1 or may perform the function ofthe panel controller 144.

The controller 780 may include a multimedia module 781 for multimediaplayback. The multimedia module 781 may be provided in the controller180, or may be provided separately from the controller 780.

The controller 780 perform a pattern recognition process for recognizinghandwriting input or drawing input performed on the touchscreen ascharacters and images, respectively.

The power supply unit 790 may supply external power or internal poweraccording to the control of the controller 780, and may supply thevoltage required for the operation of the respective components.

FIGS. 9 a and 9 b are cross-sectional views illustrating a camera moduleaccording to a first embodiment, FIG. 10 is a cross-sectional viewillustrating a camera module according to a second embodiment, and FIG.11 is a cross-sectional view illustrating a camera module according to athird embodiment.

Referring to FIGS. 9 a to 11, the camera module 1100A, 1100B or 1100Caccording to the present embodiment may include a first printed circuitboard 1110, first adhesive members 1120, a second printed circuit board1130, an image sensor 1140, a filter 1150, and a housing 1160.

The first printed circuit board 1110 may be a rigid-flex printed circuitboard (R-FPCB), a PCB, a ceramic board, or the like.

The first adhesive members 1120 may be disposed on the first printedcircuit board 1110, and the first adhesive members 1120 may be spacedapart from each other by a predetermined distance. Here, the spaceddistance may be greater than the width of the image sensor 1140 in orderto secure the space in which the image sensor 1140, which will bedescribed below, may be disposed.

The second printed circuit board 1130 may be disposed on the firstadhesive members 1120, and the second printed circuit board 1130 may bedisposed so that the lower edge of the second printed circuit board 1130may be adhered to the first adhesive members 1120.

The image sensor 1140 may be coupled to the lower portion of the secondprinted circuit board 1130 so as to be disposed between the firstadhesive members 1120.

The image sensor 1140 serves to collect the incident light and generatean image signal. A semiconductor device used in the image sensor 1140may be a Charged Coupled Device (CCD) or a CMOS image sensor, and may bea semiconductor device that captures an image of a person or an objectusing a photoelectric conversion element and a charge coupled device andoutputs an electric signal.

The image sensor 1140 may be mounted on the first printed circuit board1110 through a CSP process, as illustrated in FIGS. 9 a to 11.

The CSP process refers to a package that includes an area not greaterthan 1.2 times that of a die or that has a solder ball pitch of 0.8 mm.The image sensor 1140 may take the form of a package, and may have amodular structure along with a filter 1150, a metal wiring pattern (notillustrated) formed on the filter 1150, and a passivation layer (notillustrated) for protecting the wiring pattern (not illustrated).

The image sensor 1140 may be coupled to the lower portion of the secondprinted circuit board 1130. The image sensor 1140 may be spaced apartupwards from the first printed circuit board 1110, and a space may beformed between the image sensor 1140 and the first printed circuit board1110.

The filter 1150 may be disposed on the top of the second printed circuitboard 1130.

The filter 1150 may be made of a glass material, and may be provided asa glass substrate.

In a conventional camera module, a housing is disposed on the edge of afirst printed circuit board so as to surround a passive element disposedon the edge of the first printed circuit board. When the housing isdisposed on the first printed circuit board, a reduction in the size ofthe camera module is limited.

In the present embodiment, the housing 1160 may be disposed on the upperedge of the second printed circuit board 1130.

Here, the center line C of the lower end surface of the housing 1160 maybe disposed in an area in which the center line coincides with thecenter line C′ of the first adhesive member 1120 in the verticaldirection.

Since the housing 1160, to which a lens holder 1180 is fastened, isdisposed on the second printed circuit board 1130 on which the imagesensor 1140 is mounted, it is possible to prevent optical tilt, therebyrealizing a high-resolution image.

The first adhesive member 1120 may include solder balls. When the heightof the solder balls is too low, the space in which the image sensor 1140is to be disposed may be too narrow. Conversely, when the height of thesolder balls is too high, the overall height of the camera module 1100A,1100B or 1100C may be increased when the housing 1160 is disposed on thesecond printed circuit board 1130, which is adhered on the solder balls.

Therefore, the height of the first adhesive members 1120 may bedetermined such that the minimum height of the camera module ismaintained while securing the space in which the image sensor 1140 maybe disposed.

A second adhesive member 1170 may be disposed between the upper surfaceof the second printed circuit board 1130 and the lower surface of thehousing 1160. The second adhesive member 1170 may include at least oneof thermosetting epoxy or UV curing epoxy.

Referring to FIG. 10 , the second printed circuit board 1130 may beformed with a groove 1132, into which the lower end of the housing 1160is inserted.

The second adhesive member 1170 may be disposed on the inner sidesurface and the bottom surface of the groove 1132 to adhere and fix thelower end of the housing 1160 to the groove 1132.

Since the lower end of the housing 1160 is inserted into and coupled tothe groove 1132, the height of the housing 1160 may be reduced by thedepth to which the lower end of the housing 1160 is inserted into thegroove 1132.

As illustrated in FIG. 11 , a protrusion 1134 may be formed on theexterior of the upper portion of the second printed circuit board 1130so as to abut the outer lower end of the housing 1160.

The height of the protrusion 1134 may be greater than the thickness ofthe second adhesive member 1170 in order to prevent the second adhesivemember 1170 from leaking out of the second printed circuit board 1130.

As illustrated in FIGS. 9 a to 11, the image sensor 1140 may beflip-chip bonded to the second printed circuit board 1130.

When the image sensor 1140 is mounted on the second printed circuitboard 1130 through the flip chip process, the second printed circuitboard 1130 may be a multilayered ceramic board.

The flip chip process is a process in which an electrode pattern or aninner lead is formed with a protrusion using an energizing member suchas a solder ball so as to realize electric connection when a chip suchas the image sensor 1140 is mounted on the second printed circuit board1130.

Accordingly, it is possible to reduce the connection space compared withconventional wire bonding. In particular, flip chip bumping is alsogenerally referred to as under bump metallurgy (UBM). Since it isdifficult to directly form a solder or an Au bump on an AL or Cuelectrode of a semiconductor chip, in order to ensure easy adhesion andto prevent diffusion to the chip, a multilayered metal layer formedbetween the electrode and the bump may be composed of three layersincluding a bonding layer, a diffusion preventing layer, and a wettablelayer. The flip chip connection process is known technology, and thus,an additional description thereof is omitted.

As illustrated in FIG. 9 a , an infrared-blocking layer 1125 may bedisposed on the surface of the filter 1150. However, the disclosure isnot limited thereto, and the infrared-blocking layer may be disposed onthe bottom surface of the filter 1150, as illustrated in FIG. 9 b , ormay be formed in the middle of the filter 1150. In addition, theinfrared-blocking layer 1125 may be attached to the filter 1150 to havethe form of a film or may be formed through coating. In addition, theinfrared-blocking layer may also be an antiglare (AR) coating.

The infrared-blocking layer 1125 may optimize the range of light thatthe image sensor 1140 may sense. That is, when the image sensor 1140senses near-infrared light (˜1150 nm), other than visible light (400-700nm), which is visible to the human eye, the image sensor 1140 may failto capture only an image corresponding to the visible light and thevoltage level of a pixel signal, which is the base of the image, may besaturated. Accordingly, the infrared-blocking layer 1125 may filterincoming optical signals and provide the filtered optical signals to theimage sensor 1140.

The infrared-blocking layer 1125 may be manufactured by various methods.For example, the infrared-blocking layer 1125 may be manufacturedthrough vacuum thin film deposition. Manufacture may be performed, forexample, by alternately depositing (e.g., 30 to 40 layers of) twomaterials having different indices of refraction (e.g., TiO2/SiO2 orNb2O5/SiO2) on a glass substrate. Thus, the infrared-blocking layer 1125manufactured by this method may transmit visible light and reflectnear-infrared light. That is, the infrared-blocking layer 1125, whichreflects the incoming infrared light, may be formed by stacking aplurality of layers. The infrared-blocking layer 1125 may be designedsuch that adjacent layers among these layers have different indices ofrefraction so as to extinguish the infrared light reflected from therespective layers via destructive interference. For example, there areinfrared-blocking materials including high refractive index materialssuch as TiO2, ZrO2, Ta2O6 and Nb2O5, and low refractive index materialssuch as iO2 and MgF2, and an infrared-blocking layer may be generated bystacking these materials in multiple layers.

The infrared-blocking layer 1125 may block near-infrared light byabsorbing the near-infrared light. In the case of the infrared-blockinglayer 1125, the light introduced from the lateral side may beefficiently filtered. Examples of an infrared-absorbing material mayinclude blue glass in which a pigment such as copper ions is dispersed.Alternatively, the infrared-blocking layer 1125 may be formed bycombining a reflector that reflects infrared light and an absorber thatabsorbs infrared light.

When the infrared-blocking layer 1125 is disposed on the filter 1150,the filter 1150 may serve as an infrared-blocking filter even if aseparate infrared-blocking filter is provided in the camera module. Whenthe infrared-blocking layer 1125 is formed on the filter 1150, thecamera module may be decreased in size since it is not necessary toprovide a separate infrared-blocking filter.

The camera module 1100A, 1100B or 1100C according to the embodiment mayfurther include a lens holder 1180 coupled inside the housing 1160.Then, at least one lens 1182 may be disposed in the lens holder 1180.

The lens holder 1180 may be screwed to the housing 1160. However, thedisclosure is not limited thereto, and the housing 1160 may beintegrally formed with the lens holder 1180.

A thread 1181 may be formed on the outer circumferential surface of thelens holder 1180, and at least one lens 1182 may be disposed inside thelens holder. Then, the thread 1181 is screwed into a female thread 1161formed in the inner circumferential surface of the housing 1160 so thatthe focus between the lens 1182 and the image sensor 1140 may beadjusted. A camera module having an optical system formed in this manneris called a focusing-type camera module.

Meanwhile, although not illustrated, the housing 1160 may be integrallyformed with the lens holder 1180. That is, when injection molding thehousing 1160, the lens holder 1180 may be insert-injected therein, and aplurality of lenses 1182 may be directly fastened inside the lens holder1180. A camera module having an optical system formed in this manner iscalled a focusing-free-type camera module.

The camera module according to the embodiment may further include apassive element 1190 disposed on the first printed circuit board 1110.

The passive element 1190 may be disposed on the edge of the firstprinted circuit board 1110 and may serve as a noise remover or acontroller for image data processing of the image sensor 1140.

In addition, the passive element 1190 may be formed on the first printedcircuit board 1110 via surface mount technology (SMT).

As described above, in the camera module according to the embodiment,since the housing, which has conventionally been disposed on theoutermost portion of the first printed circuit board, is disposed on thesecond printed circuit board inside the first printed circuit board, itis possible to minimize the size of the camera module. In addition,since the housing, to which the lens holder is fastened, is disposed onthe second printed circuit board on which the image sensor is mounted,it is possible to prevent optical tilt, thereby realizing ahigh-resolution image.

The first printed circuit board 1110, the second printed circuit board1130, the first adhesive members 1120, the filter 1150, and the housing1160 described in FIGS. 9 a to 11 may respectively correspond to thesecond holder 600, the first holder 400, the conductive adhesive, thefilter 410, and the base 210 described with reference to FIGS. 1 to 8 .

FIG. 12 is an explanatory view of an example of a camera device 2010according to an embodiment of this disclosure.

Referring to FIG. 12 , the camera device 2010 may be implemented as adevice including a camera module or a device having a camera function,such as a mobile phone, a smart phone, a tablet PC, or a notebookcomputer including a camera module. The camera module may include animage sensor package. The camera device 2010 may include a lens assembly2050, an image sensor package 2100, and a host controller 2150. Thecamera module may be the image sensor package 2100 itself, or mayinclude the lens assembly 2050 and the image sensor package 2100.

The lens assembly 2050 may receive optical signals introduced fromoutside the camera device 2010 and transmit the optical signals to theimage sensor package 2100. The lens assembly 2050 refracts the opticalsignals with a field of view and a focal distance depending on thespecifications required for the camera device 2010 and transmits therefracted optical signals to the image sensor package 2100.

The lens assembly 2050 may include at least one lens, or may form anoptical system by aligning two or more lenses about the central axisthereof. In addition, the lens assembly 2050 may adjust the focaldistance under the control of the host controller 2150 in order toprovide the focal distance required by the host controller 2150.

To this end, the lens assembly 2050 may adjust the focal distance byvarying the position of at least one lens using a voice coil motor(VCM). Alternatively, the lens assembly 2050 may include a liquid lenscomposed of a conductive liquid and a non-conductive liquid, which arenot mixed with each other and form an interface, and may adjust thefocal distance by controlling the interface between the conductiveliquid and the non-conductive liquid using a driving voltage.

The image sensor package 2100 may include an image sensor. The imagesensor converts an optical signal, which has passed through the lensassembly 2050, into an electric signal using each of a plurality ofpixels and then generates a digital signal corresponding to the opticalsignal via analog-digital conversion of the converted electric signal.The plurality of pixels may be arranged in a matrix, and each of theplurality of pixels may include a photoelectric conversion element(e.g., a photodiode) and at least one transistor for sequentiallyoutputting the voltage level of the photoelectric conversion element.The image sensor may output the digital signal corresponding to theoptical signal in units of frames or pixels. In some embodiments, theimage sensor may include an image signal processor (ISP) for processingand outputting the digital signal.

In addition to the image sensor, the image sensor package 2100 mayinclude a component for protecting the image sensor, a component forelectrical connection with the host controller 2150, and a component forcoupling the image sensor to the lens assembly 2050. A more detailedconfiguration will be described with reference to FIG. 13 .

The host controller 2150 may receive the digital signal (i.e., imagedata) corresponding to the optical signal from the image sensor package2100 and may generate a control signal for controlling the operation ofthe image sensor. In some embodiments, the host controller 2150 maygenerate a control signal for controlling the VCM or a liquid lens ofthe lens assembly 2050.

The host controller 2150 may be implemented as a central processing unit(CPU), an application processor (AP), or the like, but the scope of thedisclosure is not limited thereto.

FIG. 13 is a view illustrating one embodiment of an image sensor packageillustrated in FIG. 12 .

Referring to FIG. 13 , the image sensor package 2200 includes a rigidflexible printed circuit board (RFPCB) 2020, a flexible printed circuitboard (FPCB) 2021 included in the RFPCB 2020, a circuit element 2022, areinforcement member 2023, an image sensor 2024, a glass 2025, aconnector 2026, and outer walls 2027.

The RFPCB 2020 may be a PCB in which a rigid PCB overlaps and is joinedto a section of the FPCB 2021 which is a flexible PCB. The RFPCB 2020may be implemented so as to be very thin, and the rigid PCB and theflexible PCB may be electrically connected to each other.

As illustrated in FIG. 13 , a section of the RFPCB 2021 (a sectionlocated between the right outer wall 2027 and the connector 2026) may beexposed to the outside, and the exposed section may be bent and mountedas needed as needed when mounted on the camera device 2010.

The RFPCB 2020 may be electrically connected to the image sensor 2024,and may also be connected to the connector 2026 so as to be electricallyconnected to an external control circuit (e.g., the host controller 2150in FIG. 12 ).

A portion of the RFPCB 2020 (a section corresponding to the centralportion of the image sensor 2024) may be removed through a punchingprocess or a routing process. A portion of the RFPCB 2020 may be removedin order to allow optical signals to pass through the lens assembly 2050and the glass 2025 without loss to thereby reach the image sensor 2024.

In some embodiments, the RFPCB 2020 may include s circuit (e.g., an ISP)for processing image data output from the image sensor 2024.

The circuit element 2022 may be a passive element (e.g., a capacitor ora resistor) or an active element (e.g., an OPAMP) for constituting acircuit when the RFPCB 2020 includes a separate circuit. The element maybe shaped so as to protrude from the PCB.

The reinforcement member 2023 serves to reinforce the strength of theRFPCB 2020 in order to prevent deformation thereof. The reinforcementmember may be disposed on the top of the RFPCB 2020 except for aposition corresponding to the circuit element 2022. The reinforcementmember 2023 may be formed of aluminum having high thermal conductivityand high strength, and the exterior of the aluminum may be coated with ablack coating material having high light absorptance in order to lowerthe reflectance of optical signals. The reinforcement member 2023 may bebonded to the RFPCB 2020 through a bonding process, but the scope of thedisclosure is not limited thereto.

The image sensor 2024 may refer to the image sensor described in FIG. 12. The image sensor 2024 may be electrically connected to the RFPCB 2020through a flip chip process in a first area AREA1. Although only oneleft area is designated as the first area AREA1 in FIG. 13 , the area onthe opposite right side about the image sensor 2024 also corresponds tothe first area AREA1.

The flip chip process refers to a process of forming a bump on a chipwithout wire bonding and then bringing the bump into contact with amounting board so as to connect the chip to a circuit of the mountingboard. Here, the chip may be the image sensor 2024, and the mountingboard may be the RFPCB 2020.

The glass 2025 may be formed of a glass having high transparency and mayhave a predetermined curvature in order to guide optical signals to anarea in which an active area of the image sensor 2024, that is, pixels,is located. An infrared-ray (IR) film may be attached to the top of theglass 2025 to block infrared rays. In addition, the glass 2025 may be afilter that restricts or passes a certain wavelength of external light.For example, the glass 2025 may be an IR-cut filter. The glass 2025 maybe bonded to the reinforcement member 2023 through a bonding process.The glass 2025 may be directly bonded to the RFPCB 2020 in some cases,but the RFPCB 2020 may be relatively more elastic than the reinforcementmember 2023, and therefore may be deteriorated in adhesive force withthe glass 2025 when bending, twisting or the like thereof occurs. Thereinforcement member 2023 may be disposed on the RFPCB 2020 and theglass may be disposed on the reinforcement member 2023 in order tocompensate for deterioration in the adhesive force, for example.

The connector 2026 may include at least one terminal, which electricallyconnects RFPCB 2020 to an external control circuit (e.g., the hostcontroller 2150 in FIG. 12 ).

The outer walls 2027 may serve to protect the circuit element 2022, theglass 2025, and the like from other external modules, and may be bondedto the reinforcement member 2023 through a bonding process. The outerwalls 2027 may be attached to and fixed to the lens assembly 2050.

The RFPCB 2020 may have a first thickness T1 (within a range from about0.15 mm to about 0.25 mm) and a combination of the RFPCB 2020 and thereinforcement member 2023 may have a second thickness T2 (within a rangefrom about 0.2 mm to about 0.4 mm)

In the image sensor package 2200 according to the embodiment of thepresent invention, since the sum of the thicknesses of the RFPCB 2020and the reinforcement member 2023 above the image sensor 2024 (in thedirection in which optical signals are introduced) is merely the secondthickness, the sum of the thicknesses of the image sensor package 2200and the lens assembly 2050 may be reduced, which may increase the marginof design in the vertical direction of the lens assembly 2050. Due tothe increase in the margin of design, the lens assembly 2050 mayincrease the number of lenses and the distance to which the lenses maybe moved by the VCM, which may enhance the performance of the cameradevice.

In addition, it is possible to increase the margin of design for anyother module which may be disposed below the image sensor 2025 (in thedirection opposite the direction in which the optical signals areintroduced) and to reduce the thickness of the entire camera device2010, which may contribute to the miniaturization of the camera device2010.

In addition, a process required for electrical connection from the imagesensor 2024 to the RFPCB 2021 requires only one flip chip process, whichmay simplify the entire process.

According to another embodiment, the reinforcement member 2023 may notbe included in the structure of the image sensor package 2200 in FIG. 13, in which case the overall thickness of the image sensor package 2200may be further reduced.

In FIG. 13 , the image sensor 2024 has a form of being exposeddownwards. When other components in the camera device 2010 are disposedbelow the image sensor package 2200, a protective cap (not illustrated)may be attached so as to surround the image sensor 2024 in order toprevent impacts from being applied to the image sensor 2024.

The protective cap (not illustrated) may have a greater area and heightthan the image sensor 2024 and may be shaped so as to have one opensurface. The protective cap may be attached to the RFPCB 2020 through abonding process so as to surround the image sensor 2024. The protectivecap (not illustrated) may be realized as a plastic workpiece having highthermal conductivity and high strength, but the scope of the disclosureis not limited thereto.

FIG. 14 is a view illustrating another embodiment of the image sensorpackage illustrated in FIG. 12 .

Referring to FIG. 14 , an image sensor package 2300 may include the FPCB2021, the circuit element 2022, the reinforcement member 2023, the imagesensor 2024, the glass 2025, the connector 2026, and the outer walls2027.

That is, the image sensor package 2300 may have a structure in whichonly the FPCB 2021, but not the RFPCB 2020, is included, unlike theimage sensor package 2200 of FIG. 13 .

Thus, a flip chip process of connecting the image sensor 2024 to theFPCB 2021 may be performed on the FPCB 2021 in a second area AREA2.However, since the flip chip process may require a certain level ofstrength or more, the flip chip process may be performed after the FPCB2021 and the reinforcement member 2023 are attached to each other.

As a result, the FPCB 2021 may have a third thickness T3 (of about 0.05mm), and a combination of the FPCB 2021 and the reinforcement member2023 may have a fourth thickness T4 (within a range from about 0.1 toabout 0.2 mm). Thereby, the overall thickness of the image sensorpackage 2300 may be further reduced.

Here, in order to increase the strength of the FPCB 2021, thereinforcement member illustrated in FIG. 14 may be thicker than thereinforcement member illustrated in FIG. 13 .

For convenience of description, the description related to FIG. 14 isfocused on differences from FIG. 13 , and the image sensor package 2300may have substantially the same structure, material, and function as theimage sensor package 2200 except for these differences.

FIG. 15 is a top view of the image sensor package illustrated in FIG. 13or FIG. 14 .

Referring to FIG. 15 , an upper surface 2400 of the image sensor package2200 or the image sensor package 2300, which is viewed from above,includes the reinforcement member 2023 disposed on the top of the FPCB2021. An area of the RFPCB 2020 or the FPCB 2021, which corresponds toan active area ACT of the image sensor 2024 in which a plurality ofpixels is located, may be removed to enable transmission of opticalsignals.

The reinforcement member 2023 may not be provided, and the circuitelement 2022 may be disposed on a portion of the RFPCB 2020 or the FPCB2021, and the position of the circuit element 2022 and the number ofcircuit elements are not limited to those illustrated in FIG. 15 .

In addition, another portion (central portion) of the RFPCB 2020 or theFPCB 2021 is exposed without being attached to the reinforcement member2023 so as to be bent according to the internal design specifications ofthe camera device 2010.

The left area about the exposed FPCB 2021, in which the image sensor2024 is disposed, may be referred to as a first sub-package, the areacorresponding to the exposed FPCB 2021 may be referred to as a secondsub-package, and the right area about the exposed FPCB 2021, in whichthe connector 2026 is disposed may be referred to as a thirdsub-package.

FIG. 16 is a view illustrating an image sensor package according to acomparative example of this disclosure.

Referring to FIG. 16 , the image sensor package 2500 has a functionsimilar to that of the image sensor package 2100 illustrated in FIG. 12, but has a structure different from that of the image sensor packageillustrated in FIG. 13 or FIG. 14 .

More specifically, the image sensor 2024 may be electrically connectedto a third area AREA3 via a ceramic PCB 2050 through a flip chipprocess.

The ceramic PCB 2050 is a PCB formed of a ceramic material and has asufficient strength to perform a flip chip process. However, tool costsmay increase due to shrinkage/expansion during processing, andmass-production may be difficult due to an array-type process.

In addition, due to the characteristics of the ceramic material, a highfiring temperature (about 1300° C.) is required, and it is impossiblefor the ceramic PCB 2050 to directly insert an FPCB thereinto, like anRFPCB.

Therefore, after the ceramic PCB 2050 and the image sensor 2024 areconnected to each other, the ceramic PCB 2050 is electrically connectedto the FPCB 2021 via a fourth area AREA4 through an anisotropicconducting film (ACF) so that two PCBs are stacked. The ACF processrefers to a process of inserting an ACF film between two PCBs andapplying heat to bond the two PCBs.

The reinforcement member 2023 may be attached to the lower portion ofthe FPCB 2021 to increase the strength of the FPCB. In order to satisfythe limitation of a design, the connector 2026 may be attached to thelower portion of the FPCB 2021 and the reinforcement member 2023 may beattached to the upper portion of the FPCB 2021 so as to be opposite theconnector 2026.

Here, the ceramic PCB 2050 needs to have a fifth thickness (of about 0.6mm) or more in order to prevent cracks during shrinkage and expansion inthe process.

In some embodiments, a cavity PCB structure may be used in order toprevent the overall thickness of the image sensor package 2500 fromincreasing. The cavity PCB structure refers to a structure in which theoverall thickness may be reduced while the number of stacked PCBs ismaintained. This corresponds to the structure in which the image sensor2024 is included in the form of a packet inside the ceramic PCB 2050through a process of etching the ceramic PCB 2050 in an area of a fiftharea AREA5 in which the image sensor 2024 and the ceramic PCB 2050overlap each other.

The overall thickness of the image sensor package 2500 must be increaseddue to the influence of the ceramic PCB 2050, and the thickness must beadditionally increased since a separate FPCB 2021 needs to be used.

In addition, when the cavity structure is used in order to minimize anincrease in the thickness of the image sensor package 2500, anadditional etching process is required, and an ACF process forconnection between the ceramic PCB 2050 and the FPCB 2021 isadditionally required, which increases costs.

The RFPCB 2020, the image sensor 2024, and the glass 2025 described inFIGS. 12 to 16 may respectively correspond to the first holder 400, theimage sensor 500, and the filter 410 described with reference to FIGS. 1to 8 . In addition, needless to say, the embodiment described withreference to FIGS. 12 to 16 may further include the second holder 600when it includes the technical features of the embodiment described withreference to FIGS. 1 to 8 .

The camera module according to an embodiment of the present inventionmay include all of a first feature, which is a technical feature of theembodiment described with reference to FIGS. 1 to 8 , a second feature,which is a technical feature of the embodiment described with referenceto FIGS. 9 a to 11, and a third feature, which is a technical feature ofthe embodiment described with reference to FIGS. 12 to 16 .

For example, the camera module may include all of a feature (anexemplary first feature) in that a first holder and a second holder arecoupled and electrically connected to each other by a conductiveadhesive and the second holder surrounds an image sensor coupled to thelower portion of the first holder, a feature (an exemplary secondfeature) in that a housing is disposed on a second printed circuitboard, which is adhered at the lower edge thereof to a first adhesivemember, which is disposed so as to be spaced apart from a first printedcircuit board, and a feature (an exemplary third feature) in that anRFPCB is disposed above an image sensor and is electrically connected tothe image sensor.

In a camera module according to another embodiment of the presentinvention, any one of the first to third features may be omitted asneeded.

In other words, the camera module according to the embodiment of thepresent invention may include any one of the first to third features, ormay include a technical feature obtained by combining at least two ofthe first to third features.

Although only several embodiments have been described above, variousother embodiments are possible. The technical ideas of the embodimentsdescribed above may be combined into various forms unless they areincompatible techniques, and thereby new embodiments may be realized.

The above described features, configurations, effects, and the like areincluded in at least one of the embodiments, and should not be limitedto only one embodiment. In addition, the features, configurations,effects, and the like as illustrated in each embodiment may beimplemented with regard to other embodiments as they are combined withone another or modified by those skilled in the art. Thus, contentrelated to these combinations and modifications should be construed asincluding in the scope and spirit of the embodiments as disclosed in theaccompanying claims.

INDUSTRIAL APPLICABILITY

Embodiments may be applied to a camera module including an image sensorfor photographing a subject and a portable device including the same.

What is claimed is:
 1. A camera module comprising: a first circuitboard; a housing disposed on the first circuit board; a lens holderdisposed in the housing; an image sensor coupled to a first region of alower surface of the first circuit board; a second circuit boarddisposed below the image sensor; and a first adhesive member coupled toa second region of the lower surface of the first circuit board and anupper surface of the second circuit board, wherein a lower surface ofthe housing is coupled to an edge of an upper surface of the firstcircuit board, wherein the first circuit board comprises a protrusionformed on the upper surface thereof so as to abut an outer lower end ofthe housing, wherein the protrusion of the first circuit board is notoverlapped with the first adhesive member in a first directionperpendicular to a lower surface of the image sensor, and wherein theprotrusion of the first circuit board is disposed outside of the firstadhesive member when viewed from a top side.
 2. The camera moduleaccording to claim 1, wherein a length of the first adhesive member inthe first direction is greater than a length of the image sensor in thefirst direction.
 3. The camera module according to claim 1, comprising afilter disposed on the upper surface of the first circuit board andfacing the upper surface of the image sensor.
 4. The camera moduleaccording to claim 1, wherein the first adhesive member is a solderball.
 5. The camera module according to claim 1, wherein the firstcircuit board and the image sensor are coupled and electricallyconnected to each other by a conductive adhesive.
 6. The camera moduleaccording to claim 1, wherein the second region of the lower surface ofthe first circuit board is an edge of the lower surface of the firstcircuit board.
 7. The camera module according to claim 1, wherein thesecond circuit board is a printed circuit board or ceramic board and thefirst circuit board is a printed circuit board.
 8. The camera moduleaccording to claim 1, wherein the filter is coupled to an inner side ofthe edge of the upper surface of the first circuit board.
 9. The cameramodule according to claim 1, comprising a second adhesive memberdisposed between the lower surface of the housing and the upper surfaceof the first circuit board, wherein the second adhesive member iscoupled to the housing and the first circuit board.
 10. The cameramodule according to claim 3, wherein the filter is an infrared-blockingfilter or a blue filter.
 11. The camera module according to claim 1,wherein the lower surface of the image sensor is spaced apart from thesecond circuit board.
 12. The camera module according to claim 1,wherein an upper surface of the image sensor is coupled to the lowersurface of the first circuit board, and wherein the first adhesivemember is overlapped with the lower surface of the image sensor in adirection parallel to the lower surface of the image sensor.
 13. Thecamera module according to claim 1, wherein the first circuit boardincludes a first edge extending outwardly of a first side of thehousing, and a second edge extending outwardly of a second side of thehousing opposite the first side of the housing.
 14. A camera modulecomprising: a first circuit board; a housing disposed on the firstcircuit board; a lens holder disposed in the housing; an image sensorcoupled to a lower surface of the first circuit board; a second circuitboard disposed below the image sensor; a first adhesive member coupledto the lower surface of the first circuit board and an upper surface ofthe second circuit board; and a conductive adhesive coupled to the lowersurface of the first circuit board and an upper surface of the imagesensor and electrically connecting the image sensor and the firstcircuit board, wherein the first adhesive member comprises two adhesivemembers coupled to the lower surface of the first circuit board, and theimage sensor is disposed between the two adhesive members, wherein alower surface of the housing is coupled to an edge of an upper surfaceof the first circuit board, wherein the first circuit board comprises aprotrusion formed on the upper surface thereof so as to abut an outerlower end of the housing, wherein the protrusion of the first circuitboard is not overlapped with the first adhesive member in a firstdirection perpendicular to a lower surface of the image sensor, andwherein the protrusion of the first circuit board is disposed outside ofthe first adhesive member when viewed from a top side.
 15. The cameramodule according to claim 14, wherein each of the two adhesive membersis a solder ball.
 16. The camera module according to claim 14, wherein athickness of the first adhesive member in a direction perpendicular tothe upper surface of the second circuit board is greater than athickness of the image sensor in the direction perpendicular to theupper surface of the second circuit board.
 17. The camera moduleaccording to claim 14, wherein the conductive adhesive is overlappedwith the image sensor in a direction perpendicular to the upper surfaceof the second circuit board.
 18. The camera module according to claim14, wherein the lower surface of the image sensor is higher than theupper surface of the second circuit board.
 19. The camera moduleaccording to claim 14, wherein the lower surface of the image sensor isoverlapped with the two adhesive members in a direction parallel to thelower surface of the image sensor.
 20. The camera module according toclaim 14, wherein the first circuit board includes a first edgeextending outwardly of a first side of the housing, and a second edgeextending outwardly of a second side of the housing opposite the firstside of the housing.